Simcenter FloTHERM

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About FloTHERM


FloTHERM uses advanced CFD techniques to predict airflow, temperature, and heat transfer in components, boards, and complete systems, including racks and data centers. It's also the industry's best solution for integration with MCAD and EDA software.

FloTHERM is the undisputed world leader for electronics thermal analysis, with a 98 percent user recommendation rating. It supports more users, application examples, libraries and published technical papers than any competing product.

FloTHERM has been enabling engineers from a wide range of industries for 25 years, helping them create virtual models of electronic equipment, perform thermal analysis, and test design modifications quickly and easily before any physical prototypes are built.

Defence & Aerospace

Thermal management is a crucial factor to maintain avionics system reliability and increased advancements in technology require state-of-the-art thermal simulation tools. 

FloTHERM offers electronics cooling capabilities and EDA interfaces to optimize the workflow and accuracy for high-reliability product developments:

  • EDA data utilization for high accuracy
  • PCB trace representation
  • Die to rack dimension scale resolution


FloTHERM offers state-of-the-art simulation technologies for automotive electronics, where increasing miniaturization has made thermal management critical, yet hard to achieve. Using FloTHERM, automotive engineers can solve tasks from the smallest die to the largest enclosure:

  • Real-time meshing
  • Detailed die to enclosure dimension scale resolution
  • Fast and high accuracy solving
  • Vast electronics cooling features and capabilities


FloTHERM delivers the right level of functionality regardless of the packaging level design task required:


As components shrink, thinner die result in greater inter-die temperature variation, so that junction temperature can no longer be considered a single value. Intra-die effects resulting from die stacking makes hot spot temperature and location dependant on the power distribution on the die, and is a function the use profile. Detailed package thermal models and die power maps are needed for the most challenging products designs with active power management. In the semiconductor industry, 3D-ICs are forcing IC design flows to become temperature-aware.

Electronic Components

Accurate component temperature prediction is necessary to ensure components operate within safe limits. Across the design flow, a component’s representation must evolve predict heat flux split between the board and the air or attached heatsink, case temperature, and junction temperature, and in extreme cases temperature variation across the die itself. Suppliers are required to provide thermal models to their customers that support their design needs.


PCB cooling depends strongly on the local air flow distribution, which is disrupted as air passes over the components on the board, leading to maldistribution, recirculations and hot spots on the board, and is exacerbated by the addition of heatsinks. Component placement and the design of the board itself strongly influence component cooling. Cooling can be enhanced by careful attention to the copper content and layout close to the component, and through the use of thermal vias below components.


Electronics cooling is a challenge that starts at the system-level, particularly for air-cooled electronics. Air flow through the system cools the electronics, but is disrupted by the electronics and other internal geometry. Changes to either the enclosure or the electronics alters the air flow rate and distribution and consequently the cooling, making adding heatsinks as a design afterthought perilous. Correct sizing and positioning of fans and vents and heatsink sizing and optimization are system-level design tasks.


In datacenters, the design of the cooling system has a great influence on whether or not the datacentre will be able to achieve its design capacity and not be limited by cooling issues. The choice of cooling system dramatically affects operating cost and thermal interaction between racks. This thermal interaction makes the deploying, moving or refreshing assets an unacceptable business risk for today’s mission critical facilities.